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Electrical & Computer Engineering
Integrated Microfabrication Lab
Machine Scheduler

Etching

Anelva RIE

Reactive Ion Etching using CF4 and O2 chemistries.

    Modutek Hotpot

    Heated area of the wet bench area where KOH etching of Silicon takes place.

      PE2 Plasma Etcher

      O2 plasma etching of thin organic films such as photoresist residue. This system has two parallel plates for a planar etch.

        STS ICP Etcher

        Highly directional inductively coupled plasma etcher for etching silicon.

          Trion ICP Etcher

          Highly directional inductively coupled plasma etcher for etching silicon, silicon nitride, silicon dioxide, and metals.