Photoresist Manufacturers
Below is a list of photoresist manufacturers and a table of photoresists. We do not claim that either of these is comprehensive. There are other manufacturers and photoresists, but these are some of the more common ones. Some of the names given in the photoresist table are the names of series and not individual resists. A series may include many individual photoresists. Some photoresists have more information than others. We only included information that was easily and quickly obtainable from the manufacturers' websites. Many of them may have more uses or applications than noted here. Some manufacturers provide datasheets or product guides and the links for those have been included in the table. If you desire more information about a specific photoresist please check the manufacturer's website or contact the manufacturer.
| Manufacturer | Photoresist | Tone | Thickness (in µm) | Exposure Wavelengths (in nm) | Aspect Ratio/Resolution | Primary Uses/Application |
| AZ | AX series | 193 | contact holes, line/space | |||
| AZ | DX and EXP series | 248 | multi-purpose, back end | |||
| AZ | HiR 1075 | Positive | 0.6-1.2 | i | Ultra high | line/space, contact holes |
| AZ | MiR 701 | Positive | 0.6-3.0 | i | High | line/space, contact holes |
| AZ | MiR 703 | Positive | 0.8-1.4 | i | Mid-range | line/space, contact holes |
| AZ | MiR 900 | Positive | 2-4.5 | i | High aspect ratio | line/space |
| AZ | N6000 | Negative | 0.6-10 | i | ion implant, high speed | |
| AZ | nLOF 2000 | Negative | 1.8-10 | i | lift off | |
| AZ | nLOF 5000 | Negative | 0.75-1.5 | i | High | lift off |
| AZ | 3300 | Positive | 1-2.5 | ghi | general purpose | |
| AZ | 3300-F | Positive | 0.8-5 | ghi | general purpose, high speed | |
| AZ | 1500 | Positive | 0.4-4 | ghi | general purpose, wet etch | |
| AZ | N4000 | Negative | 2.5-5.5 | gh | ||
| AZ | P4000 series | Positive | Feb-55 | gh | 2:01 | |
| AZ | 4500 series | Positive | Feb-55 | gh | 2:01 | |
| AZ | 9200 series | Positive | Mar-50 | ghi | 3:01 | |
| AZ | 10XT | Positive | Apr-50 | ghi | 3:01 | plating and etch applications |
| AZ | 50XT | Positive | 15-65 | gh | 3:01 | plating and etch applications |
| AZ | PLP-30 | 25-Jun | gh | 2:01 | ||
| AZ | PLP-40 | 20-30 | gh | 2:01 | ||
| AZ | 5XT series | Positive | 5-Mar | ghi | 2:01 | |
| AZ | 12XT series | Positive | 20-May | ghi | 4:01 | Cu RDL and TSV applications |
| AZ | 40XT series | Positive | 20-100 | ghi | 4:01 | etch and plating applications |
| AZ | 125nXT series | Negative | 20-120 | ghi | 6:01 | |
| AZ | 5nXT/15nXT | Negative | 20-May | ghi | 3:01 | Cu RDL and TSV plating/etch |
| AZ | TX 1311 | 5-Mar | DUV | 15:01 | ||
| DJ MicroLaminates | SUEX series | Negative | 100-500+ | UV - X-Ray | 20:01 | Dry Film resists for MEMS, plating, microfluidics, WLP and more |
| DJ MicroLaminates | ADEX series | Negative | May-75 | UV - X-Ray | 4:01 | Dry Film resists for MEMS, plating, microfluidics, WLP and more |
| DOW | Laminar series | dry film photoresists for alkaline and acid etch and pattern plating | ||||
| DOW | Eagle 2100 ED | Negative | printed circuit board manufacturing | |||
| DOW | Photoposit series | roller coated photoresists for printed circuit boards | ||||
| DOW | Epic 2135 | 193 | 65 nm and 90 nm node processes | |||
| DOW | UVN 2300 | Negative | DUV | implant and cell open applications | ||
| DOW | UV series | Positive | 0.5-3 | 248 | ||
| DOW | MCPR i7010N | Positive | >0.35 | i | general purpose | |
| DOW | Megaposit SPR 955-CM | Positive | >0.35 | i | general purpose | |
| DuPont | Riston Etchmaster 213/830 | Negative | 30 | 350-380 | dry film resist, acid etch, chemical milling | |
| DuPont | Riston Goldmaster GM100 | 50/75/100 | 350-380 | dry film resist, gold plating, adhesion to various metals | ||
| DuPont | Riston MultiMaster MM100i/MM500 | 30/40/50/65/75 | 350-380 | dry film resist, general purpose, alkaline etch, gold plating | ||
| DuPont | Riston PlateMaster PM200/PM300 | Negative | 38/40/50/75/100 | 350-380 | dry film resist for copper, tin, tin/lead plating | |
| DuPont | Riston TentMaster TM200i | Negative | 30/38 | 350-380 | dry film resist, tent and etch processes, acid etch | |
| DuPont | Riston Laser LDI 300/500/7000/7200/8000 | Negative | 30/38/40/50/62/75 | 355/405 | dry film resist, laser direct imaging | |
| DuPont | Riston FX 250/500/900 | Negative | 15,30,40,50,62 | 350-380 | dry film resist, Ni/Au plating, fine lines, chemical milling, acid etch | |
| Eternal | Etertec Series | Dec-50 | dry film resists, plating, print-and-etch, tent-and-etch, chemical milling, PKG | |||
| Eternal | Laminar Series | 24-101 | dry film resists, plating, print-and-etch, tent-and-etch, LDI for some | |||
| Fujifilm | FEP-100 | Positive | e-beam | e-beam direct write | ||
| Fujifilm | FEN-100 | Negative | e-beam | e-beam direct write | ||
| Fujifilm | GAR series | 193 | various | |||
| Fujifilm | GKR series | 248 | various | |||
| Fujifilm | SC series | Negative | >1 | g | general purpose, resistant to common silicon etchants | |
| Fujifilm | HNR series | Negative | >1 | g | ||
| Fujifilm | HR series | Negative | >1 | g | ||
| Fujifilm | IC series | Negative | >1 | g | ||
| Fujifilm | HPR 500 series | Positive | >0.75 | g | ion implant, wet and dry etching | |
| Fujifilm | OCG 825 | >0.75 | g | |||
| Fujifilm | HiPR 6500 series | >0.75 | gi | |||
| Fujifilm | OiR series | Positive | >0.25 | gi | various | |
| Fujifilm | FHi series | >0.25 | gi | |||
| Fujifilm | GiR 1102 | 0.25-0.4 | i | |||
| Fujifilm | PMMA | Positive | DUV/e-beam | 7:01 | various | |
| Hitachi | RD series | 15/25 | 355-405 | High | dry film, DLP and UV-LDI systems | |
| Hitachi | DL series | 20/25 | High | dry film, DLP systems | ||
| Hitachi | SL series | 20/25/29/38 | High | dry film, UV-LDI systems | ||
| Hitachi | RY series | 19/25 | High | dry film, PKG | ||
| Hitachi | H series | 25/30/34/38/45 | High | dry film, PCB production, tenting | ||
| Hitachi | HM series | 56/75/112 | High | dry film, electro-forming | ||
| Hitachi | FR series | 25/38/50 | dry film, FPC production | |||
| Hitachi | FZ series | 20/25/30/35 | dry film, solder resist, PKG | |||
| HiTech | DiaEtch 101 | Negative | 300-350 | Dip-coating application for various metallic substrates | ||
| HiTech | DiaEtch 102 | Negative | >25 | 300-450 | Dip-coating application for printed circuit boards | |
| HiTech | DiaEtch 120 | Negative | >25 | 300-450 | Roller-coating application for printed circuit boards | |
| HiTech | DiaEtch 122 | Negative | >25 | 300-450 | Roller-coating application for various metallic substrates | |
| HiTech | DiaPlate | 5-500 | Electroforming process, adhesion to various substrates | |||
| JSR Micro | ARX series | Positive | ArF(193) | line/space, contact hole, implant | ||
| JSR Micro | M series | Positive | KrF(248) | line/space, contact hole, implant | ||
| JSR Micro | V series | Positive | KrF(248) | implant | ||
| JSR Micro | NDS series | Negative | KrF(248) | implant | ||
| Kolon | Trumask | Negative | inner layer, lead frames, BGA, roller or dip-coated | |||
| MacDermid | PMGI and LOR | Positive | <0.05 - >8 | DUV/240-290 | Sacrificial Layer, Bi-layer Lift-off | |
| Kayaku Advanced Materials | SU-8 series | Negative | <1 - >300 | Near UV/350-400 | 10:01 | Permanent applications |
| Kayaku Advanced Materials | KMPR 1000 | Negative | <4 - >120 | i | High | MEMS, electrolytic plating, DRIE applications |
| Kayaku Advanced Materials | PMMA | Positive | <0.1 - >5 | DUV/e-beam/x-ray | High | T-gates, e-beam and x-ray processes, protective coatings, sacrificial layer |
| Sumitomo | Sumiresist | Positive |