| Company/Service | Thin Films-Dielectrics | Thin Films-Metals | Epitaxial Services | Cleaning | Reclaim | Standard Cleanroom | Ingot Slicing | Backgrinding | Polishing | Lapping | Other Services |
| Wafernet | X | X | - | - | - | - | - | - | - | - | - |
| University Wafer | X | X | - | - | - | X | - | - | - | - | X |
| Pi-KEM (Compart Technology) | - | - | - | - | - | - | - | - | - | - | - |
| Episil | - | - | X | - | - | - | - | - | X | X | X |
| PureWafer | X | X | - | X | X | - | X | - | X | X | X |
| Global Silicon Technologies | - | - | - | - | - | - | - | X | - | - | - |
| Polishing Corp of America | X | X | - | X | X | - | X | X | X | X | - |
| International Wafer Service | X | X | X | - | - | X | - | X | - | X | X |
| Silicon Crystal Inc. | - | - | - | - | - | - | - | X | X | X | - |
| Wafer World Inc. | - | - | - | X | X GaAs | - | - | - | X | - | X |
| Silicon Valley Microelectronics | X | X | X | X | X | - | X | X | X | X | Dicing, Coring, lithography |
